LAS VEGAS, Feb. 6, 2001 — Today at the Microsoft® Windows® Embedded Developers Conference (DevCon), Microsoft Corp. announced that leading silicon vendors (SVs) have pledged to extend their support to the next version of the Windows CE operating system, currently code-named
through the formation of the Windows Embedded Strategic Silicon Alliance (WESSA). Members of WESSA include ARM Ltd., Agere Systems (formerly Lucent Technologies Inc.’s Microelectronics Group), Alchemy Semiconductor Inc., Cirrus Logic Inc., Hitachi Ltd., Hyundai Electronics, Intel Corp., LinkUp Systems Corp., MIPS Technologies Inc., National Semiconductor Corp., NEC Corp., Philips Semiconductors Inc., Samsung Semiconductor, STMicroelectronics Inc., Texas Instruments Inc. and Toshiba Corp. WESSA is a collaborative effort between Microsoft and the alliance members to optimize
for their architectures via access to source code and joint development efforts. As a result of these efforts, OEMs will be able to develop high-performing Windows CE-based devices that take advantage of the latest microprocessor technologies.
In addition to WESSA, Microsoft also announced two new silicon vendor programs to further enable OEMs to quickly and easily evaluate and bring to market Windows Powered embedded devices. Building on the rich functionality available in Windows CE 3.0, Microsoft will make available a number of new board support packages (BSPs) later this spring. BSPs are preconfigured and pretested software packages that, together with the hardware reference platforms, enable OEMs to jump-start their embedded designs and thereby significantly reduce their time to market. These BSPs, based on industry-leading processor architectures from Advanced Micro Devices Inc., ARM, Hitachi, Intel, MIPS Technologies, National Semiconductor and NEC, will be available for download from the Microsoft Web site.
Microsoft also announced today a program that will enable silicon vendors to include an evaluation copy of Platform Builder 3.0, the Windows CE 3.0 comprehensive toolkit, and a run-time license with their boards. Beginning in February, National Semiconductor will offer a Windows CE operating system image and the Platform Builder 3.0 evaluation kit on its development board based on its Geode processor technology. Beginning in April, Hitachi will offer a similar program for its SuperH-based Hardware Architecture Reference Platforms (HARP). Not only will the program allow OEMs and applications developers to obtain everything they need from a single contact, it will also significantly reduce the time they need to spend evaluating and developing Windows Powered solutions. In the future, Microsoft will continue to work with additional silicon vendors such as ARM, Intel, MIPS and NEC, as well as IHVs to develop similar programs.
“We have seen significant customer momentum around Windows CE 3.0 and the resulting relationships it is enabling,”
said Bill Veghte, vice president of the Embedded and Appliance Platforms Group at Microsoft.
“The formation of WESSA, along with these new silicon vendor programs, will further enable OEMs to quickly and easily build innovative Windows Powered solutions optimized for the silicon architecture of their choice.”
WESSA Alliance Members and Supported Technologies
will support ARM’s latest technologies, ARM V5TE and ARM1020T as well as the 720T and 920T.
Agere Systems. “Talisker”
will support Agere’s ARM-based processor cores in communications systems-on-a-chip.
Alchemy Semiconductor. “Talisker”
will support Alchemy’s line of MIPS-based processors.
Cirrus Logic. “Talisker”
will support Cirrus Logic’s line of ARM-based processors.
will support Hitachi’s SuperH family processors.
will support Hyundai’s line of ARM-based processors.
will support Intel’s current StrongArm and x86-based processors, as well as the forthcoming Intel XScale microarchitecture.
will support LinkUp’s line of ARM-based processors.
MIPS Technologies. “Talisker”
will support MIPS Technologies’ latest architectures, MIPS32 and MIPS64, as well as MIPS16 and MIPS-based processors derived from R4000 and R5000 CPUs.
National Semiconductor. “Talisker”
will support National Semiconductor’s Geode family of x86-based processors.
will support NEC’s VR series MIPS processors.
will support Philips’ line of MIPS32-based processors.
will support Samsung’s line of ARM-based processors.
will support STMicroelectronics’ STPC, ST40 and ST50 architectures.
Texas Instruments. “Talisker”
will support Texas Instruments’ line of DSP-based solutions.
will support Toshiba’s line of MIPS-based processors.
About the Microsoft Windows Embedded Family and Microsoft
The Microsoft Windows Embedded operating systems and tools provide comprehensive software platforms for building the next generation of intelligent, 32-bit connected Windows Powered devices that demand rich applications and Internet services for a wide range of flexible solutions. In addition, Microsoft offers a wide range of programs and services designed to meet
the specific needs of Windows Embedded customers, industry partners and developers. Windows Embedded includes the Windows CE 3.0 and Windows NT® Embedded 4.0 operating system.
Founded in 1975, Microsoft (Nasdaq
) is the worldwide leader in software, services and Internet technologies for personal and business computing. The company offers a wide range of products and services designed to empower people through great software — any time, any place and on any device.
Microsoft, Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corp. in the United States and/or other countries.
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